FR-4
Fr-4 (135 C Tg) Shengyi S1141, Shanghi NanYa SN-L4
We carry a wide array of single and double sided materials in various
copper weights and thicknesses to meet your requirements. These materials meet
the RoHS directive but may not be the best option for Lead Free Assembly.
Lead Free FR-4 (175 C Tg) Shengyi S1170, Ventec VT-47
These materials are RoHS and are well suited for Lead Free Assembly. These
are Phenolic cured resin systems that have a Td (Temperature of Degradation)
of greater than 340 C, which is needed for the elevated temperatures of Lead
Free Assembly. We currently use the VT-47 materials exclusively for our
multilayer design construction.
Megtron / GETEK (180 C Tg)
Megtron is a high speed, high performance PPO/Epoxy based resin system. It
has a low dielectric constant of 3.8 and can achieve high speed signal
transmissions (500 MHz - 2 GHz) . It is used in telecommunication devices,
routers, switching equipment, high speed transfer equipment, Computers, etc.
BT / Epoxy
Allied Signal / Isola G200
The blending of bismaleimide / triazine and epoxy resin provides enhanced
thermal, mechanical and electrical performance over standard epoxy systems. BT / Epoxy
possesses characteristics that make it an excellent selection for larger panel sizes.
Advantages such as a high Tg (180C) , Low coefficient of thermal expansion and excellent
electrical insulation in high humidity and at higher temperatures make this an good
material choice.
Polyimide
Allied Signal / Isola P95, P96
This base material system is engineered with an all polyimide resin that is
suitable for any electronics that would normally require the ultimate performance of
Kerimide 601 ( The past standard polyimide of the industry ). Thermal stability makes this
material particularly attractive to applications with stringent high temperature
requirements. Low coefficient of thermal expansion of the board provides plated through
hole reliability in very high layer counts and thick MLB's.
Considerations: Polyimide material is extremely expensive compared to FR4.
It's processing is also more difficult, leading to higher board prices. Polyimides
are also not 94V-0 so you must consider your application. Alternatives may be
BT-epoxy or possibly a high temperature epoxy like FR-406.
PTFE
Taconic TLT -
Link to Taconic tech page
PTFE / woven glass materials have exceptionally well controlled electrical and
mechanical properties. The dielectric constant range is 2.45 to 2.65 and can be specified
anywhere within this range with a tolerance of +/- .05. The dissipation factor is
approximately .0006 when measured @ 1MHz. Typical applications for TLT laminates include
radar systems, phased array antennas, mobile communication systems, microwave test
equipment, microwave transmission devices and RF components. Due to the wide range of Dk
values and the custom nature of this material, special orders may be necessary.
Kapton
Dupont Pyralux AP
Pyralux copper-clad laminated composites are constructed of DuPont Kapton polyimide
film with copper foil on one or both sides, bonded together with a modified acrylic
adhesive. Pyralux laminated composites are typically used to produce high reliability,
high density circuitry of flexible, rigid-flex, and all-flexible multilayer constructions.
* Information on this page is for comparison only. Nationwide Circuits makes no
warranties on the accuracy of this data and assumes no liability arising out of its use by
others. Please refer to the manufactures of these materials for more in-depth information.
