Standard

Advanced (Limited Qty)

Material Types

1-2 Layers

Polyimide, Dupont (AP,LF,FR)

Polyimide, Dupont (AP,LF,FR)

3-6 Layers

Polyimide, Dupont (AP,LF,FR)

Polyimide, Dupont (AP,LF,FR)

Material Thickness (Core in Mils)

1-2 Layers

.001 - .005

.006 + Special order core

3 Layers

.003 - .012

.013 +

4 Layers

.004 - .013

.014 +

6 Layers

.006 - .017

.018 +

Layer Count

1-6

Max Board Size

1-2 Layers

16.00 X 22.00"

16.50" X 22.00"

Mulitlayer

16.00 X 22.00"

16.00" X 22.00"

Copper Weight

Outer Layer

.5 - 2 oz

3 + oz

Inner Layer

.5 - 2 oz

3 + oz

Trace / Space (min)

Outer Layer

.004" / .004"

.003" / .003"

Inner Layer

.004" / .004"

.003" / .003"

PCB Edge to Conductor Min

.015"

.010"

Minimum Dielectric Thickness

.001"

.001"

Smallest Drilled Via

.010"

.008"

    Outer Via Pad Min.

.026"

.020"

    Inner Via Pad Min.

.026"

.020"

    Inner Layer Clearance Min.

.038"

.030"

PTH Tolerance Finished

+/- .003"

+/-.002"

Max Aspect Ratio

1:1

1:1

Plated Slots Min

.030"

.020"

Plated Features

Bumps pads, Pattern plate

Surface Finishes

ENIG, Immersion Tin

HASL, ENIG, Pb Free HASL, Tin, Silver

Covercoat (w/ adhesive)

Dupont (LF,FR) .002"+

Soldermask Color

Flex LPI : color green

Soldermask Dam (min)

.005"

.003"

Soldermask Clearance (min)

.004"

.002"

Legend Colors

White, Yellow, Black, Red, Blue

Controlled Impedance + / -

10 %

10 %

SMT Pitch for Electrical Test

.012"

.008"

Min Rout Width

.062"

.031"

IPC Class

Class II

Class III

Additional Options

Rigid / Flex (up to 10 layers)

.030 - .200"   130Tg-180Tg,   Polyimide, FR4, AP LF, FR

Stiffeners

.003 - .125 FR4, Polyimide, Kapton

LPI Covercoat

Dupont PC (Photoimageable Covercoat)

Epoxy Fillet @ Bend

Ecco Bond 45 (black or clear)

Pressure Sensitive Tape

3M 467MP / 200MP Adhesive

Flex LPI w/ Covercoat

Taiyo Flex LPI w/ Dupont (LF, FR)

Skiving / flying Leads

Laser Ablation of substrate to create windows or expose leads