|
Rigid Capabilities
List
| |
Standard |
Advanced (Limited
Qty) |
|
Material Types |
1-2 Layers |
FR-4, FR-4(180 Tg) |
Teflon, Bt-Epoxy, Polyimide, Duriod Etc. |
|
|
Multilayer |
FR-4, FR-4(180 Tg) |
Teflon, Polyimide, Rogers, Arlon, Hybrids |
|
Material Thickness |
2 Layers |
.010 - .125 |
.008 - .200" |
|
|
4 Layers |
.031 - .125 |
.018 - .250" |
|
|
6 Layers |
.047 - .125 |
.031 - .250" |
|
|
8 Layers |
.062 - .125 |
.047 - .250" |
|
Layer Count |
|
1-10 |
12 + |
|
Max Board Size |
2 Layers |
16.00 X 22.00" |
16.50" X 23.00" |
|
|
Mulitlayer |
16.00 X 22.00" |
16.00" X 22.50" |
|
Copper Weight |
Outer Layer |
1 - 2 oz |
3 - 8 oz |
|
|
Inner Layer |
1 - 2 oz |
3 - 6 oz |
|
Trace / Space (min) |
Outer Layer |
.005" / .005" |
.003" / .004 |
|
|
Inner Layer |
.005" / .005" |
.003" / .004" |
|
PCB Edge to Conductor Min |
|
.015" |
.010" |
|
Minimum Dielectric Thickness |
|
.005" |
.003" |
|
Smallest Drilled Via |
|
.0138" |
.010" |
|
Outer Via Pad
Min. |
|
.026" |
.020" |
|
Inner Via Pad
Min. |
|
.026" |
.020" |
|
Inner Layer
Clearance Min. |
|
.038" |
.030" |
|
PTH Tolerance Finished |
|
+/- .003" |
+/-.002" |
|
Max Aspect Ratio |
|
8:1 |
10:1 |
|
Plated Slots Min |
|
.030" |
.020" |
|
Plated Features |
|
Bumps, Edges, Countersinks / Bores, Pockets, Castellations |
|
Plated Countersinks (Deg.) |
|
80, 90, 100 |
80, 90, 100 |
|
Surface Finishes |
|
HASL, ENIG |
HASL, ENIG, Pb Free HASL, Tin, Silver |
|
Soldermask Color |
|
Green, Blue, Black, Red |
|
Soldermask Dam (min) |
|
.005" |
.003" |
|
Soldermask Clearance (min) |
|
.004" |
.002" |
|
Legend Colors |
|
White, Yellow, Black, Red, Blue |
|
Controlled Impedance + / - |
|
10 % |
10 % |
|
SMT Pitch for Electrical Test |
|
.012" |
.008" |
|
Bow & Twist |
|
.75 % |
.75 % |
|
Min Rout Width |
|
.062" |
.031" |
|
IPC Class |
|
Class II |
Class III |
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of this chart
|