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Button or Pads Only Plating

  Button plating or pads only plating is a process where a hole is selectively plated to provide an electrical connection between two sides of a printed circuit board. This is accomplished by using a masking technique to allow only the pad and barrel of a hole to be plated. This allows the traces to remain unplated and therefore retain the physical properties of the original laminated foil. Since electoplated copper (ED) does not have the flexibility of rolled-annealed (RA) copper this is especially important with flex materials that will see continuous flexing and twisting.

 

Advantages of Button Plating

Disadvantages of Button Plating
1) The flexible circuit has to flex as part of its function. Continual or dynamic flex applications where the circuit maybe required to flex 10's of thousands of times

2) When fine lines and spaces are required. In example, for a design requiring sub 5 mil lines and spaces, using button plating won't add extra copper that makes the pattern more difficult to etch

3) Very tight bend radius. If a very tight or sharp bend radius is required to install a circuit, button plating will help to make the circuit more flexible and more reliable.

1) Additional handling and process steps by the manufacturer will increase cost.

2 ) Larger via / component pads are needed to allow for any misregistration of the drilled hole to the button plating mask, and to the final artwork pattern

Terms:
Rolled-annealed (RA) Copper Foil -
Electroplated or Electrodeposited (ED) Copper -
Minimum Bend Radius -


Nationwide Circuits, Inc.

Phone 1-800-724-4800
Fax (585) 328-9152
E-Mail
sales@nciproto.com

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Copyright Nationwide Circuits Inc.
Last revised: September 02, 2011